TEECE
Thermal Engineering of Electrical Equipment and Electronic Components
This team focuses on scientific research and technological development related to heat transfer, thermal behavior, and cooling strategies for electrical equipment and electronic components. Its work is rooted in the long-established study of flow systems with heat transfer under natural, forced, and mixed convection.
The team addresses thermal constraints in increasingly compact and high-performance electronic components, where heat dissipation has become a major engineering challenge. Using numerical simulation, the team investigates the magnetohydrodynamic and thermal behavior of magnetic systems immersed in cavities filled with ferromagnetic fluids, while also addressing the electrical, thermal, electromechanical, and maintenance aspects of industrial equipment.
Research Overview
Team 3 develops research on the thermal and electromechanical behavior of electrical and electronic systems, with a particular focus on heat dissipation, advanced cooling approaches, and numerical modeling of complex thermal and magnetic phenomena.
Scientific Themes
Heat Transfer and Convection
Study of thermal flows involving natural, forced, and mixed convection in industrial and scientific applications.
Cooling of Electronic Components
Development of innovative cooling approaches for compact, high-performance electronic components subject to severe thermal constraints.
Numerical Simulation of Magnetothermal Systems
Modeling of magnetohydrodynamic and thermal behavior of magnetic systems immersed in cavities filled with ferromagnetic fluids.
Electromechanical and Maintenance Aspects
Analysis of industrial equipment from electrical, thermal, electromechanical, and maintenance perspectives.
Keywords
Team Composition
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Team Leader
Team Members
Doctoral Researchers
Selected Publications
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